Researchers in Singapore now promise a longer shelf life for food using a unique packaging. Two individuals from the National University of Singapore has reportedly developed food packaging which is chemical and preservative-free.
Today Online said medical student Ms Tan Yi Min and Associate Professor Thian Eng San of the Department of Engineering worked on the development of the packaging which they tagged as "environment-friendly." It added that the material of the packaging is clear from any harmful chemicals and has also the ability to slow down the growth of fungus.
The same report explained that the researchers made use of a material called "chitosan" to make the packaging. This is said to be taken from the exoskeletons of crustaceans and was mixed with grapefruit seed extract to hinder the growth of microorganisms and other fungal properties.
"Extending the shelf-life of food products also means reducing food waste, and as a result, reducing the rate of global food loss. This will bring about both environmental and economic benefits," said Ms Tan Yi Min in a similar Antara News report.
For his part, the associate professor claimed that their main aim was "to improve food safety, extend shelf-life and to minimize the use of chemical preservatives." "Consumers are also demanding that packaging materials be formulated from natural materials that are environmentally friendly and biodegradable while improving food preservation," he added.
This newly introduced packaging can extend the shelf life of bread three times longer. It explained that bread stored using a normal packaging would have molds after three days while this introduction will keep the food fresh up to the 10th day.
Since the introduction of this breakthrough, the research has already received the support of the A*STAR Singapore Institute of Manufacturing and Technology (SIMTech) and the Food Innovation & Resource Centre (FIRC) of Singapore. The researchers, as per Antara News, are expected to continue working on the improvements for this technology.
